17 results
Modeling of “Pad-in-a-Bottle”: A Novel Planarization Process Using Suspended Polymer Beads
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1560 / 2013
- Published online by Cambridge University Press:
- 17 July 2013, mrss13-1560-bb02-01
- Print publication:
- 2013
-
- Article
- Export citation
Slurry Particle Agglomeration Model for Chemical Mechanical Planarization (CMP)
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-E04-03
- Print publication:
- 2010
-
- Article
- Export citation
Characterization and Modeling of Pad Asperity Response in CMP
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-E05-04
- Print publication:
- 2010
-
- Article
- Export citation
Wafer Level Modeling of Electrochemical-Mechanical Polishing (ECMP)
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C11-04
- Print publication:
- 2007
-
- Article
- Export citation
CMP at the Wafer Edge – Modeling the Interaction between Wafer Edge Geometry and Polish Performance
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W5.1
- Print publication:
- 2005
-
- Article
- Export citation
Characterizing STI CMP Processes with an STI Test Mask Having Realistic Geometric Shapes
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K9.4
- Print publication:
- 2004
-
- Article
- Export citation
CMP Modeling and Characterization for Polysilicon MEMS Structures
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K7.6
- Print publication:
- 2004
-
- Article
- Export citation
Coherent Chip-Scale Modeling for Copper CMP Pattern Dependence
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K2.4
- Print publication:
- 2004
-
- Article
- Export citation
Re-Examining The Physical Basis of Pattern Density and Step Height CMP Models
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F1.3
- Print publication:
- 2003
-
- Article
- Export citation
Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 782 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, A10.2
- Print publication:
- 2003
-
- Article
- Export citation
Integrated Chip-Scale Prediction of Copper Interconnect Topography
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F7.5
- Print publication:
- 2003
-
- Article
- Export citation
Nanotopography Issues in Shallow Trench Isolation CMP
-
- Journal:
- MRS Bulletin / Volume 27 / Issue 10 / October 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 761-765
- Print publication:
- October 2002
-
- Article
- Export citation
Modeling and Mapping of Nanotopography Interactions with CMP
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 732 / 2002
- Published online by Cambridge University Press:
- 01 February 2011, I1.5
- Print publication:
- 2002
-
- Article
- Export citation
Modeling of Pattern Dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 671 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, M4.3
- Print publication:
- 2001
-
- Article
- Export citation
Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (CMP) Processes Using a Large Pattern Test Mask
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 671 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, M4.4
- Print publication:
- 2001
-
- Article
- Export citation
Wafer Nanotopography Effects on CMP: Experimental Validation of Modeling Methods
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 671 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, M4.9
- Print publication:
- 2001
-
- Article
- Export citation
Using Wafer-Scale Patterns for CMP Analysis
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 613 / 2000
- Published online by Cambridge University Press:
- 14 March 2011, D11.8.1/E8.8.1
- Print publication:
- 2000
-
- Article
- Export citation